Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“. Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas. 2000.
Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up … Wikipedia
Wire bonding — Das Drahtbonden (von engl. bond Verbindung , Haftung ) bezeichnet in der Elektronik Fertigung einen Verfahrensschritt, bei dem mittels dünner Drähte (Bonddraht) ein Chip (engl. die, zum Beispiel ein integrierter Schaltkreis, eine Leuchtdiode, ein … Deutsch Wikipedia
ultrasonic welding — A high tech welding procedure used for metals (e.g., in wire bonding of integrated circuits) and plastics. Pressure is applied to the parts to be joined and ultrasonic vibrations are transmitted through the materials; frictional heat at the… … Dictionary of automotive terms
Ultrasonic welding — is an industrial whereby high frequency ultrasonic acoustic vibrations are locally applied to workpieces being held together under pressure to create a solid state weld. It is commonly used for plastics, and especially for joining dissimilar… … Wikipedia
Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… … Wikipedia
Ultraschalldrahtbonden — ultragarsinis vielinių išvadų privirinimas statusas T sritis radioelektronika atitikmenys: angl. ultrasonic wire bonding vok. Ultraschalldrahtbonden, n rus. ультразвуковая сварка проволочных выводов, m pranc. soudage des sorties en fil par… … Radioelektronikos terminų žodynas
soudage des sorties en fil par ultrason — ultragarsinis vielinių išvadų privirinimas statusas T sritis radioelektronika atitikmenys: angl. ultrasonic wire bonding vok. Ultraschalldrahtbonden, n rus. ультразвуковая сварка проволочных выводов, m pranc. soudage des sorties en fil par… … Radioelektronikos terminų žodynas
ultragarsinis vielinių išvadų privirinimas — statusas T sritis radioelektronika atitikmenys: angl. ultrasonic wire bonding vok. Ultraschalldrahtbonden, n rus. ультразвуковая сварка проволочных выводов, m pranc. soudage des sorties en fil par ultrason, m … Radioelektronikos terminų žodynas
ультразвуковая сварка проволочных выводов — ultragarsinis vielinių išvadų privirinimas statusas T sritis radioelektronika atitikmenys: angl. ultrasonic wire bonding vok. Ultraschalldrahtbonden, n rus. ультразвуковая сварка проволочных выводов, m pranc. soudage des sorties en fil par… … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
